...Yi Xie; Jian Huang; Daoguo Yang; Miao Cai; Hongbo Qin; Zhi Liang Purpose This study aims to investigate the fracture behavior and reliability of large-area sintered Cu for power electronic packaging, with a specific focus on the influence of the “edge effect” on interfacial performance...

... areas and modified electroplating process parameters, the underlying causes of nodule formation were revealed, and engineering solutions were proposed. This research holds significant importance for enhancing the stability of the wafer-level copper electroplating process and the reliability...

...Le Lei; Bing Lei; Lingbo Li Purpose This study aims to investigate the reliability of solder joints in a NOR Flash device with joint errors under thermal cycling loads. Design/methodology/approach A numerical analysis using the finite element method was conducted in this study. Four...

... ) growth and improving thermal reliability. Design/methodology/approach A thermal migration test platform was used to expose barrel- and hourglass-shaped Cu/Ni/Sn-3.5Ag microbump joints to a temperature gradient of 16,029°C/cm. Through the integration of FE-SEM, electron backscatter diffraction...

...Jiacheng Zhou; Jinglin Shi; Lei Xu; Fuwen Zhang; Zhigang Wang; Qiang Hu; Huijun He Purpose The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth...

... implications The integration of TiO₂ reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative...

...; and no chemical reactions involved in the whole process. It should be noted that the assumption of linear elastic behavior used in this study may yield slightly higher mechanical stress in the data analysis. Microstructure Reliability Modeling Moisture diffusion The moisture diffusion...

...Meng Jiang; Yang Liu; Ke Li; Zhen Pan; Quan Sun; Yongzhe Xu; Yuan Tao Purpose The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS). Design/methodology/approach In this study, HTS at 250 °C...

... to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations. Design/methodology/approach Therefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA...

... a detrimental impact on reliability. The mechanical stresses caused by the thermal changes of the assembly lead to fatigue and sometimes the failure of the solder joints. The purpose of this study is to propose a novel pad design to obtain an interrupted solder/substrate interface, to improve the PCBA...

...Shuo Huang; Yang Liu; Ke Li Purpose The purpose of this paper is to compare the single-sided packaging structure and double-sided packaging structure of high-power module and study the overall heat dissipation performance and reliability of the module. Design/methodology/approach In this paper...

... temperature of the chip are 107 lm/W and 72.3°C, respectively, which meets the requirements of street lights. After aging for 1,080 h, the light attenuation is 84.64% of the initial value, which indicates that it has higher reliability and longer life. Originality/value It can provide reference data...

... of considering both severe and running mechanical shocks which is the real case in electric converters in the automotive and aerospace applications. This paper aims to asses the reliability of the solder joint under mixed exposure of mechanical loads. Design/methodology/approach Mechanical failure process...

...Mathias Ekpu Purpose In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most reliable materials available. Thermal interface materials (TIMs) are used in electronic...

...Frank Kwabena Afriyie Nyarko; G. Takyi Purpose A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted. Design/methodology/approach A three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature...

... of power cycling have been determined. Originality/value This paper aims to testify the combined effects of thermal and power cycling loads on the reliability of solder ball joints with barrel- and hourglass-type geometries in an electronic system. The finite element simulation outcomes showed...

...Mohd Najib Ali Mokhtar; M.Z. Abdullah; Abdullah Aziz Saad; Fakhrozi Cheani Purpose This paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint quality of the self-alignment assemblies of SnAg...

... layer. Originality/value In the published literature, there is a lack of data in the area of fatigue assessment of lead-free solders under combined temperature and vibration loadings. This paper provides useful insights into combined thermal/vibration fatigue, i.e. reliability behavior of lead-free...

...Qiaoran Zhang; Abdelhafid Zehri; Jiawen Liu; Wei Ke; Shirong Huang; Martí Gutierrez Latorre; Nan Wang; Xiuzhen Lu; Cheng Zhou; Weijuan Xia; Yanpei Wu; Lilei Ye; Johan Liu Purpose This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon...

... Emerald Publishing Limited Licensed re-use rights only Reliability Sintering Double-side assembly Power chip High-voltage power modules have achieved significant progress to meet the increasing demands and applications of power chips, such as insulated gate bipolar transistor (IGBT...